Process Engineer – Die / Wire bonding

Safran Sensing Technologies Switzerland SA

Safran Sensing Technologies Switzerland SA

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Key information

Safran Sensing Technologies Switzerland SA is a world leader in the design and production of silicon microsystems (MEMS). A subsidiary of the Safran Group, we are a human-sized company and place great value on the development of our employees.

To support our growth, we wish to welcome, train and support the development of a:

Your main activities:

• Guarantee and optimize manufacturing processes, and actively participate in the development of new processes for products under development

• Lead packaging equipment selection, qualification, and process validation activities, ensuring alignment with quality standards and production goals.

• Pilot the process transfer and define the surveillance process of our off-shore subcontracting partner (Asia)

Your background and knowledge:

• Engineer in micro technology, microelectronics with experience in clean room in an industrial environment or any other experience deemed equivalent

• Minimum 2 years’ experience in assembly, wire bonding or lid sealing processes

• In-depth knowledge and interest in data statistical analysis

• Familiar with problem solving methods (8d, FMEA, brainstorming…). Lean manufacturing certification an asset.

• Fluency in both French and English

Your personal profile:

• Ability to work in a team and collaborate with other departments, set objectives, motivate, and report

• Responsible, reliable, organized, autonomous and solution-oriented

• Open to travel in Europe and outside Europe (2 weeks per year)

Our offer:

Permanent contract, 80-100%, role based in Switzerland, time flexibility, career development, equal opportunity employer.

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