R&D Engineer Power Semiconductor Packaging 80 - 100% (f/m/d)

Hitachi Energy AG

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  • Publication date:

    10 May 2024
  • Workload:

    80 – 100%
  • Contract type:

    Permanent position
  • Place of work:

    Aargau

R&D Engineer Power Semiconductor Packaging 80 - 100% (f/m/d)


At Hitachi Energy our purpose is advancing a sustainable​ energy future for all. We bring power to our homes, schools, hospitals and factories. Join us and work with fantastic people, while learning and developing yourself on projects that have a real impact on our communities and society. Bring your passion, bring your energy, and be part of a global team that appreciates a simple truth: Diversity + Collaboration = Great Innovation 

 

In our R&D BiMOS department at Hitachi Energy Semiconductors, we are developing faultless high-tech semiconductor devices and power modules. Our quality products are manufactured in advanced internal and external production sites and then delivered to a wide range of customers worldwide for different industrial applications as well as renewable energy, traction and E-mobility. 

We are currently looking for a motivated skilled R&D engineer to join the R&D Module team. The focus of the team is to develop new semiconductor power module technologies and products for different markets from initial design phase till final qualification and product release.  

 

Want to shape the future through cutting-edge development? Join our passionate team! We offer a flexible work environment that empowers you to excel, both personally and professionally. You'll have the opportunity to develop your skills and grow alongside talented colleagues.

 

Your responsibilities

  • Evaluate new joining methods and materials, investigate scientific foundation and implement technology in power semiconductor modules through qualification stage 

  • Manage projects and sub-projects related to product development for purpose of improving quality and performance as well as streaming costs 

  • Assess design from reliability and manufacturability point of view both experimentally and by modeling/simulation 

  • Build up prototypes and early-stage demonstrators 

  • Document the development works internally, publish findings in journals and conferences, contribute to inventions and patent related to power semiconductor module 

  • Work closely with process engineering team, research bodies and international suppliers as part of development partners 

 

Your background 

  • Degree in material science, mechanical engineering, physics, chemistry or similar disciplines 

  • Keen interest in high-tech products and complex topics together with the motivation to improve products through innovation 

  • Specialist knowledge of relevant joining methods (soldering, welding, sintering, bonding techniques) 

  • Hands-on experimental work and familiar with manufacturing processes ideally in power module packaging area 

  • Ideally already have first industry experience in high-tech field, but talented graduates are also welcome 

  • Knowledge on thermal, electrical and mechanical simulation skills is a plus 

  • Good command of English necessary, German is a plus 

  • Excellent communication, documentation, and presentation skills 



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