Besi Switzerland AG
Steinhausen
10 hours ago
Product Specialist Die Bonding Epoxy m/f/d 100%
- 04 March 2026
- 100%
- Permanent position
- Steinhausen
Job summary
Besi leads the semiconductor industry with expertise and innovation. Join us in Steinhausen as a Product Specialist Die Bonding Epoxy!
Tasks
- Define product requirements based on market analysis and customer needs.
- Provide high-level technical support and manage customer buy-offs.
- Collaborate with R&D to fuel innovation and conduct feasibility studies.
Skills
- Master’s or Bachelor’s in Engineering with 5+ years in semiconductor backend.
- Strong analytical skills with a focus on mechanical systems.
- Excellent English proficiency, German is a plus.
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About the job
Besi is the market leader in the semiconductor industry and has successfully asserted itself over the past decades through expertise, innovation, and flexibility.
For our location in Steinhausen ZG we are looking for a skilled and experienced Product Specialist Die Bonding Epoxy m/f/d 100%
About the job
As a Product Specialist, you are the technical heartbeat of our Product Management department. You bridge the gap between market requirements and engineering excellence. From defining the next generation of Die Bonding hardware and software to supporting global customers on-site, you ensure our technology stays ahead of the curve.
Your areas of impact
• Requirements Engineering: Define comprehensive product requirements (HW/SW) based on deep‑dive market analysis, evolving customer needs, and key market intent ensuring that product direction
• Technical Excellence & Support: Deliver high-level on-site technical support, managing complex evaluations, live product demos, and formal customer buy-offs
• Innovation & R&D Collaboration: Fuel the innovation pipeline by conducting feasibility studies, building proof-of-concepts, and scouting emerging technologies in partnership with the CTO office
• Customer Success Management: Act as the primary technical point of contact for assigned accounts, managing issue resolution and ensuring seamless product integration
• Lifecycle Strategy: Provide critical feedback on product performance and usability to influence future roadmaps and continuous improvement initiatives
• Knowledge Transfer: Conduct specialized sample builds and lead Die Bonding application training for both internal teams and international clients
Your profile
• Master’s or Bachelor’s degree in Engineering (Mechanical, Electrical, or Mechatronics)
• Industry Expertise 5+ years of experience in the semiconductor backend industry, specifically with Die Bonding (epoxy) – Hands-on experience with ESEC die bonders is highly preferred
• Proven experience in process development, requirements engineering, beta testing, and technology feasibility assessments
• High proficiency in complex mechanical systems (robotics/mechatronics) combined with strong analytical and logical thinking
• Familiarity with R&D workflows and modern product management frameworks
• An ideal opportunity for an aspiring career path in Product Management
• Excellent command of English (written and verbal); German language skills are a distinct advantage
• An independent, assertive, and flexible working style with a "strong team player" mentality
• Willingness to travel globally (>30%)