Process Engineer m/f/d 100%

About the job

As a Process Engineer, you are in the center of our next-generation semiconductor assembly solutions, and part of driving the end-to-end development and optimization of high-precision Die Bonding systems.

Your areas of impact

• System and process development
• Working closely with cross-functional teams to develop and expand existing “Die Bonder” machine modules and associated software in line with evolving customer needs
• Deriving system and process specifications for interdisciplinary development teams in mechanics, electronics, software, and control engineering
• Planning, conducting and interpretation of laboratory tests to identify suitable system parameters and sequences
• Optimization of the overall system with a focus on accuracy, repeatability, and productivity
• Development of new or extension of existing "Die Bonding" process technologies: analysis, modelling, design and testing
• Support of internal and external customers worldwide

Your profile

• Master’s or Bachelor’s degree in engineering or physical sciences (mechanical, electrical, mechatronics, microtechnology, physics, or materials science) from a university, ETH, or FH
• Professional experience in an international environment
• Profound knowledge of English is a must-have, German knowledge nice-to-have
• We are looking for a motivated team player who can work flexible and effectively in a fast-paced, dynamic and international environment and who can manage interfaces to multiple teams and organizations
• Readiness for travelling (>10%)